QUANTIFICATION OF ELECTRONIC CIRCUIT CONNECTION TECHNIQUES

Abstract

The study was directed toward gathering reliability data on several presently used electronic circuit connection types. Laboratory and field reliability reports were gathered from known producers and users of electronic equipment. In all, data for 350 billions of connection operating hours were collected during the six month study. The data covered 6 types of connections: solder, resistance welding, wire wrap, crimp, ultrasonic welding, and thermal compression bonding. Failure rates and confidence intervals were calculated and compared for each of the first four connection types. Mathematical analyses were performed on the data collected in an attempt to measure the effects of environmental stresses on connection failure rates. A merit index was developed so that designers may select optimum types of connections for use in various applications. The details of factor and subfactor selection and their quantification are described. Application weights for several classes of Air Force ground equipments are developed and presented.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1964
Accession Number
AD0603250

Entities

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Accuracy
  • Air Force
  • Aircrafts
  • Classification
  • Computers
  • Electronic Circuits
  • Electronic Equipment
  • Engineering
  • Environment
  • Failure Mode And Effect Analysis
  • Mathematical Analysis
  • New York
  • Ratings
  • Regression Analysis
  • Reliability
  • Test And Evaluation
  • United States

Readers

  • Business Analytics
  • Electrical Engineering
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems