PRODUCTION ENGINEERING MEASURE TO INCREASE THE RELIABILITY OF THE TRANSISTOR TYPE 2N2034.

Abstract

The report describes the processing developments in wafer cleaning, mesa delineation, scribing of wafer, pellet to nickel-plated header soldering, nickel-plated clip to pellet soldering, final etch of soldered unit, final test and encapsulation of etched units, and weld and hermetic seal tests for the transistor type 2N2034. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1964
Accession Number
AD0603256

Entities

People

  • D. Hughes
  • Eric W. Martin
  • F. Des Roches
  • J. Cocking
  • J. Courier

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Encapsulation
  • Engineering
  • Hermetic Seals
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Reliability
  • Soldering
  • Transistors

Fields of Study

  • Materials science

Readers

  • Metallurgy
  • Semiconductor Device Technology
  • Thermal Physics or Thermal Science.