INTEGRATED SILICON DEVICE TECHNOLOGY. VOLUME III. PHOTOENGRAVING.
Abstract
Within the limits of available information, this report describes typical photoengraving techniques used in silicon integrated device technology. The various types of photoresists and photosensitive coatings are described along with their known properties. Step-by-step procedures are included for the use of these resists. A general evaluation of the photoengraving process and its limits is included. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1964
- Accession Number
- AD0603715
Entities
People
- J. J. Wortman
Organizations
- RTI International