MAXIMUM DENSITY PACKAGING OF ANALOG ELECTRONICS,

Abstract

Electronic packaging techniques which can be applied to subminiature electronic devices and complex systems are developed. These techniques are based on the mounting and wiring of circuit components in a threedimensional unit mass. Using the most suitable electronic circuit components now available, the Instrumentation Laboratory has achieved maximum component densities. These densities are obtained without sacrificing production feasibility. The Laboratory's packaging techniques are immediately available for use and have design flexibilities great enough to handle a variety of circuitry. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1958
Accession Number
AD0604357

Entities

People

  • Richard M. Jansson

Organizations

  • Massachusetts Institute of Technology

Tags

DTIC Thesaurus Topics

  • Buildings And Structures
  • Circuits
  • Complex Systems
  • Electronic Circuits
  • Electronics
  • Electronics Laboratories
  • Instrumentation
  • Packaging
  • Production
  • Research Facilities
  • Resilience

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Space Exploration and Orbital Mechanics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems