MINIATURE PACKAGING OF ELECTRONICS IN THREEDIMENSIONAL FORM,
Abstract
By using miniature components now available from manufacturers and a newly applied method of joining wire leads, an electronic-packaging technique based on the mounting and wiring of circuit components in a miniature three-dimensional unit mass was developed. This new technique, referred to as 3-D or High-Density Electronic Packaging, has achieved a maximum component density without sacrificing production feasibility. It consists of placing circuit elements in physical contact (side by side) and forming the circuit connections on a three-dimensional basis, as opposed to the two-dimensional printed-circuit board. The wires are joined by electrical-resistance spot welding, which is similar to the vacuum-tube technique. After assembly and electrical checkout, the unit is encapsulated in epoxy potting compounds to form a module. The resulting miniature package is a maximum-density assembly utilizing all practical space within the package.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1959
- Accession Number
- AD0604501
Entities
People
- Eldon C. Hall
- Richard M. Jansson
Organizations
- Massachusetts Institute of Technology