THERMALLY CONDUCTIVE POTTING COMPOUNDS FOR 3-D WELDED ELECTRONICS,

Abstract

Internal thermal considerations for handling dense electronic modules are described. These considerations lead to the development of thermally conductive potting compounds. A concluding summary sheet presents the collected data on a number of compounds analyzed. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jan 04, 1960
Accession Number
AD0605679

Entities

People

  • R. M. Jansson

Organizations

  • Massachusetts Institute of Technology

Tags

DTIC Thesaurus Topics

  • Electronics
  • Geometry
  • Mathematics
  • Three Dimensional

Readers

  • Aerospace Test and Evaluation
  • Structural Dynamics.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics