COMPONENTS PACKAGING TECHNIQUES.

Abstract

In evaluating new design techniques for packaging electronic and electromechanical components, efforts were concentrated on cordwood arrangement of electronic parts into modules, resistance welding of electrical connections, and techniques for implementing these approaches. Advanced gyro control circuits were used as a test vehicle for integration of study efforts in four specific areas: design techniques, materials and processes, microminiaturization, and thermal and vibration studies. The design study resulted in three operational prototype assemblies containing 2548 electronic parts and three gyroscopes occupying 0.6 cubic foot and weighing 34 pounds. Basic types of metallurgical joints were defined by examination of microstructure of the welded electrical connections. Other investigations included welding process control, economic studies, connection techniques, and encapsulation studies. Microminaturization studies on the micromodule technique led to development of a hybrid design approach and sample experimental solid state circuits were evaluated. Theoretical vibration and shock studies were made on problems related to environmental testing of missile electronic equipment. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1961
Accession Number
AD0605941

Entities

People

  • George R. Beck

Organizations

  • TRW Inc.

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Assembly
  • Electrical Equipment
  • Electronic Components
  • Electronic Equipment
  • Encapsulation
  • Gyroscopes
  • Joints
  • Materials
  • Mechanical Equipment
  • Microminiaturization
  • Microstructure
  • Miniature Electronic Equipment
  • Packaging
  • Resistance Welding
  • Test Vehicles
  • Vibration
  • Welding

Readers

  • Electrical Engineering
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems