PRODUCTION ENGINEERING MEASURE TO INCREASE THE RELIABILITY OF THE TRANSISTOR TYPE 22N2034.

Abstract

The report describes the processing developments in wafer cleaning, mesa delineation, scribing of water, pellet to nickel-plated header soldering, nickel-plated clip to pellet soldering, final etch of soldered unit, final test and encapsulation of etched units, and weld and hermetic seal tests for the transistor type 2N2034. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1964
Accession Number
AD0606191

Entities

People

  • D. Hughes
  • Eric W. Martin
  • F. Des Roches
  • J. Cocking
  • J. Courier

Tags

DTIC Thesaurus Topics

  • Encapsulation
  • Engineering
  • Hermetic Seals
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Reliability
  • Soldering
  • Transistors

Readers

  • Electrical Engineering
  • Metallurgy
  • Semiconductor Device Technology