THERMAL RESPONSE IN SANDWICH PANELS.
Abstract
An analytical model is presented for predicting thermal response in honeycomb sandwich panels. The model considers a variety of configurations involving single or stacked panels. Consideration is given to all three modes of heat transfer and to temperature dependent thermophysical properties of the materials of fabrication. The heat balance equations are of the finite difference form and employ the forward difference technique for solution. A stability criterion is presented for the heat balance equations. The entire system of equations is programmed for solution on the IBM 7094 digital computer. Validity of a portion of the analytical model is established by comparing predicted results to existing experimental data for single honeycomb panels. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1964
- Accession Number
- AD0607088
Entities
People
- P. J. Kendall