PRODUCTION ENGINEERING MEASURE FOR THE PRODUCTION OF SILICON MONOXIDE CAPACITORS MICROELEMENT.

Abstract

Deposition masks were completed and used to fabricate all the required types of SiO capacitor microelements. The masks appear to be of correct dimensions. Commercially glazed and metallized substrates were tested and found satisfactory except for a thickness variation of 0.003 inch over specifications. Microelements fabricated on these substrates occasionally yielded capacitors with very low dissipation factors (0.1 -0.5%) directly from the deposition cycle; most elements however, had DF values near 4%. A post-fabrication heat treatment is used to bring the DF below 1.5%. Minor, but important modifications were made in the equipment, and the thin film monitor and microcircuit jig are operating satisfactorily. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 31, 1964
Accession Number
AD0607421

Entities

People

  • J. J. O'connor

Organizations

  • Cornell Dubilier

Tags

DTIC Thesaurus Topics

  • Capacitors
  • Dissipation
  • Dissipation Factor
  • Electronic Equipment
  • Engineering
  • Heat Treatment
  • Production
  • Production Engineering
  • Substrates
  • Thin Films

Readers

  • Electrical Engineering
  • Electronics Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems