PN JUNCTION FORMATION TECHNIQUES.

Abstract

The report describes investigations on the fabrication of silicon single-crystal cells by ion implantation techniques and thin-film cells by plasma deposition techniques. N on P cell efficiencies were raised to the 13% level through improvements in the implantation process, subsequent heat treatment, and contacting. Control of the junction characteristics and therefore cell spectral response through the inherent control of the implantation technique was conclusively demonstrated. Plasma deposition as a process was studied in detail. Much of the program involved investigations with source feed gases (silicon halides) which were incompatible with formation of semiconductor grade films by this process. Experiments with silicon hydride resulted in functional (low resistivity, doped, highly crystalline, low impurity level) films on foreign substrates (molybdenum and quartz), thereby demonstrating the basic tenets of the plasma deposition process.

Document Details

Document Type
Technical Report
Publication Date
Nov 15, 1964
Accession Number
AD0608636

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Compound Semiconductors
  • Crystals
  • Efficiency
  • Electronics
  • Extrinsic Semiconductors
  • Fabrication
  • Films
  • Heat Treatment
  • Implantation
  • Impurities
  • Ion Implantation
  • Ions
  • P-N Junctions
  • Semiconductors
  • Single Crystals
  • Thin Films

Readers

  • Semiconductor Device Technology
  • Systems Analysis and Design
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene