PRODUCTION ENGINEERING MEASURE. MICROELEMENT DIODES.

Abstract

Considerable difficulty was experienced when diodes were soldered onto the microelement lands. The difficulty was particularly pronounced under 200C storage. Under this condition, tin-lead and tin-lead-silver solders oxidized and the joint increased in resistance to an unacceptable degree, or opened completely. Superior results were achieved by the use of axial-leaded diodes (round or flat leads) mounted on the wafer, as compared to a 'button' style set into the wafer. The performance of the diodes themselves was generally very good. Evidence was obtained which indicated that the diodes were not damaged unduly by the mounting procedure, but that they benefitted from a 200C, 1000 hour burn-in prior to mounting. No appreciable difference was observed between alloy and diffused junction diodes. Some difficulty was experienced with the microelement wafers. (Author)

Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1964
Accession Number
AD0608775

Entities

Organizations

  • RTX

Tags

DTIC Thesaurus Topics

  • Alloys
  • Engineering
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Resistance
  • Silver Solders

Readers

  • Electrical Engineering
  • Mathematics or Statistics
  • Thin Film Deposition Science.