ETCHING CIRCUITRY ON METALLIZED ANODIZED ALUMINIUM,
Abstract
This report describes a method of preparing etched circuitry on metallized anodized aluminum and its use in fabricating parts for a thermoelectric temperature-control device. The method comprised anodization of type 52S aluminum, dual metal cladding with electroless nickel and electroplated copper, and photoetching of the desired circuitry on the anodized aluminum. Satisfactory adhesion of the metal conductors, high insulation resistance, and good thermal conductance of the thin anodized layer resulted in an excellent thermoelectric temperature device, and suggested other as yet unattempted applications. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 15, 1962
- Accession Number
- AD0608978
Entities
People
- Emma Lee Hebb
Organizations
- Harry Diamond Laboratories