THE INFLUENCE OF GRAIN BOUNDARIES AND STACKING FAULTS ON HIGH TEMPERATURE PLASTIC DEFORMATION.

Abstract

Data are presented on the influence of grain boundaries and stacking faults on high temperature plastic defor mation. Three specific areas were investigated: (1) the influence of grain size and annealing treatment on the primary and steady state creep characteristics of high purity copper, (2) the influence of stacking fault energy on primary and steady state creep and (3) the influence of grain size on the dislocation substructure generated during creep of an Fe - 3.0% Si alloy.

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1964
Accession Number
AD0609250

Entities

People

  • Craig Radford Barrett

Organizations

  • Stanford University

Tags

DTIC Thesaurus Topics

  • Annealing
  • Boundaries
  • Creep
  • Dislocations
  • Grain Boundaries
  • Grain Size
  • High Temperature
  • Physical Properties
  • Plastic Deformation
  • Steady State

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Semiconductor Device Technology
  • Structural Dynamics.