RELATION BETWEEN LIFETIME DISTRIBUTION AND THE STRESS LEVEL CAUSING THE FAILURES,

Abstract

This report is a continuation of the study in which the different sources for the occurrence of device failures were discussed. A method was developed for computing the mortality of environmental failures from the stressstrength distribution of a part of a device. Two models for computation of wear-out mortality are assumed, one considering sensitive devices, the other considering insensitive devices. Combinations of the mortality functions were discussed and applied to the study of actual device mortality functions. This present study is extended to cover the change in the lifetime distribution when the stresses which are significant for the occurrence of failures are increased or decreased.

Document Details

Document Type
Technical Report
Publication Date
Feb 03, 1961
Accession Number
AD0610309

Entities

People

  • Erich Pieruschka

Organizations

  • Lockheed Martin Missiles and Space

Tags

DTIC Thesaurus Topics

  • Computations
  • Mathematical Analysis

Fields of Study

  • Engineering

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