Accelerated Testing of High Reliability Parts

Abstract

A review of data and information gathered during previously conducted accelerated test programs has led to the formulation of degradation models for the parts under study. Long term constant stress tests, which were inactive for a 9-month period after accumulating 5000 to 9000 hours of test time at various stress conditions, were restarted. The effect of the passive period on the long term part parameter trends is discussed. Accelerated step stress test designs and analysis plans were formulated for metal film resistors and semiconductors and step stress tests were initiated. Failure Mechanism Studies led to the formulation of a current conduction model for glass dielectric capacitors; the detection, possible source and estimated effects of phosphorus compounds on surface leakage of transistors; and low temperature characterization of diode surface leakage currents.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1965
Accession Number
AD0610943

Entities

People

  • G. Bretts
  • Graeme Best
  • H. Lampert
  • H. S. Endicott
  • T. M. Walsh

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Capacitors
  • Chemical Reactions
  • Data Processing
  • Data Processing Equipment
  • Dielectric Permittivity
  • Energy Bands
  • Glass Capacitors
  • Measurement
  • Processing Equipment
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Spacecraft
  • Test And Evaluation
  • Test Equipment
  • Test Methods
  • Time Intervals

Fields of Study

  • Engineering

Readers

  • Analytical Chemistry
  • Software Engineering
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics