LEAD ATTACHMENT AND ENCAPSULATION TECHNIQUES FOR THIN FILM MICROCIRCUITS

Abstract

The techniques described were developed for encapsulating experimental thin film circuits deposited on 0.5-inch square glass substrates. The encapsulation is epoxy, with final package dimensions of 0.6-inch square x . 125-inch thick. Up to 32 ribbon leads emerge, on .050 centers, arranged on the periphery of the package. A factor complicating the encapsulation was the requirement that the leads emerge on the four edges of the unit. A molding process using silicone rubber molds, and a hypodermic filling arrangement was evolved.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1965
Accession Number
AD0611752

Entities

People

  • Patrick N. Everett

Organizations

  • MITRE Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Attachment
  • Circuit Boards
  • Classification
  • Computers
  • Contracts
  • Corporations
  • Electronic Circuits
  • Films
  • Instructions
  • Massachusetts
  • Microcircuits
  • Printed Circuit Boards
  • Printed Circuits
  • Security
  • Thin Films
  • United States

Readers

  • Polymer Science and Engineering.
  • Software Engineering
  • Structural Dynamics.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene