MECHANICAL AND ELECTRICAL PROPERTIES OF TIC.
Abstract
The fabrication of three grades of TiC powders, with various impurities, into high-density, fine grained, polycrystalline ceramics was studied. Metallic iron in the original powder was found to promote grain growth. The mechanical behavior of each of these materials was studied as a function of porosity, grain size, and surface finish. Normal microstructural dependencies on the transverse strength of these materials were observed. Fracture in all these materials was predominantly intergranular except where the crack path encountered large TiC crystals in the polycrystalline mass and where surface damage caused a localized influence on the crack propagation. The electrical behavior of each material was examined and attempts were made to correlate this information with the crystallographic and electronic structure of TiC and in turn the mechanical behavior observed. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1965
- Accession Number
- AD0612253
Entities
People
- W. B. Harrison
Organizations
- Honeywell International, Inc.