CHEMICAL FORMATION OF MICROCIRCUIT ELEMENTS.

Abstract

The reactive sputtering technique was applied to form films of titanium and titanium oxide with a wide range of resistivities. Low resistance metallic films and insulating oxide films are found to be suitable for resistor and capacitor microcircuit elements respectively. Dielectric constants of over 100, and reasonably low dissipation factors have been achieved. Data furnished include frequency dependence of capacitor cza,txteristics, voltage breakdown, long term stability of resistor and capacitor elements, temperature coefficients and some basic film properties. The feasibility of using titanium-titanium oxide film contact for rectification is demonstrated. High static rectification ratios are obtained. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1965
Accession Number
AD0613563

Entities

People

  • J. M. Mitchell
  • T. K. Lakshmanan

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Capacitors
  • Coefficients
  • Dielectric Permittivity
  • Dissipation
  • Dissipation Factor
  • Elements
  • Films
  • Microcircuits
  • Oxide Films
  • Oxides
  • Resistance
  • Resistors
  • Temperature Coefficients
  • Titanium
  • Titanium Oxides

Fields of Study

  • Engineering
  • Physics

Readers

  • Electrical Engineering
  • Materials Science and Engineering.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene