MICROMODULE LIFE TEST.
Abstract
Progress is reported on a micromodule life test program is to determine the Mean-Time-To-Failure (MTTF) of a typical analog and a typical digital micromodule when tested for ten thousand (10,000) hours under load at elevated temperature. The causes of micromodule failure during test are to be determined and reported to each supplier of test modules, and at the conclusion of testing, drift characteristics of each micromodule parameter are to be studied to determine attainable tolerance limits for these parameters. The number of failures, accumated operating time, and lower 60% confidence level of mean-time-to-failure for life testing completed during the quarter are reported.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 17, 1964
- Accession Number
- AD0613605
Entities
People
- G. E. Cannon