PRODUCTION ENGINEERING MEASURE. RELIABILITY THROUGH PROCESS IMPROVEMENT (EXTENSION TO 2N2525 TRANSISTOR FAMILY).

Abstract

Studies on cold-welding as the final closure operation were completed and the die design finalized. The dynamic forces exerted on the welded parts was reduced to a minimum while the tightness of the joints made is maintained. Analytical work was done to establish the residual stresses developed and the modes of failure experienced on ceramic-to-metal semiconductor enclosures; the header design was modified. The compression seals to the ceramic achieved by the use of molybdenum feedthrough pins was found to be the most suitable. The emitter lead geometry used in the case of the pin feedthrough for the emitter lead continuity to the external radial leads is highly inductive. The frequency response of the package can be improved substantially by by-passing such an inductive lead geometry and using the flang itself as the emitter contact. (Author)

Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1964
Accession Number
AD0613687

Entities

People

  • E. H. Roos
  • G. Erkan

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Cold Welding
  • Compound Semiconductors
  • Compression
  • Continuity
  • Electronics
  • Engineering
  • Frequency
  • Frequency Response
  • Geometry
  • Joints
  • Metals
  • Molybdenum
  • Production
  • Production Engineering
  • Production Management Methods
  • Residual Stress
  • Semiconductors

Fields of Study

  • Engineering
  • Materials science

Readers

  • Electrical Engineering
  • Electronics Engineering
  • Metallurgy

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems