THIN FILM MICROCIRCUIT INTERCONNECTIONS.
Abstract
The object is to further the development of state-of-theart vacuum deposition techniques as required to provide reliable vacuum deposited interfacial interconnections and electrical crossovers and to establish optimum evaluation and design criteria to verify the reliability of the interfacial interconnections and electrical crossovers being investigated. TASK I Efforts to date to isolate, separate or nullify the effects of conductors and welds from the properties of the interconnects have been of marginal effect. Separate designs for AC measurements at 100 MC and 1000 MC and for DC tests have been conceived. Each pattern has been designed to eliminate the effects of the contacts and related pad areas. Design philosophy is detailed and initial measurements on an over size trial pattern have been made. TASK II An hypothesis to the assymetrical breakdown voltages encountered with earlier Cr or CrAu electrodes has been evolved. Preliminry test results indicate that the breakdown voltage is markedly improved by the treatment suggested by the hypothesis. This treatment consists of the addition of oxygen to the process.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 31, 1964
- Accession Number
- AD0615542
Entities
People
- Bob G. Bender
- Maurice Yang
Organizations
- Hughes Aircraft Company