ACCELERATED TESTING OF HIGH RELIABILITY PARTS.

Abstract

As a result of reliability testing of glass dielectric capacitors, data has been accumulated which offers an indication of an upper temperature limit for thermal acceleration of failures. The data which is still being gathered shows that an analytical expression for insulation resistance is extremely important in formalizing the stress response of the dielectric. Preliminary analysis of high stress data indicates that the oxide film resistor, the R-2008 P5 diode and the transistors have shown significant trends or failures; however, additional work is being performed in these areas to confirm the failure mechanisms. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 01, 1965
Accession Number
AD0617141

Entities

People

  • G. Bretts
  • Graeme Best
  • H. Mclean
  • H. S. Endicott
  • T. M. Walsh

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accelerated Testing
  • Failure Mode And Effect Analysis
  • Film Resistors
  • High Reliability
  • Oxide Films
  • Reliability
  • Resistance
  • Resistors

Fields of Study

  • Engineering

Readers

  • Electronics Engineering
  • Systems Analysis and Design
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics