THE TRANSITION FROM PLANE TO CELLULAR INTERFACE IN SOLIDIFYING TIN-LEAD-ANTIMONY ALLOYS,

Abstract

The transition from plane to cellular interface in ternary tin alloys containing lead + antimony was determined experimentally. The transition between the planar and the non-planar interface can be plotted on a graph of initial concentration vs. the ratio of temperature gradient to rate of solidification, in a manner analogous to that describing the plane to cell transition in binary alloys. The observed results indicate an interaction between the lead and the antimony atoms in the alloy, which can be interpreted by assuming that the equilibrium distribution coefficient of the lead atoms has decreased as a result of the addition of the antimony atoms. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 02, 1963
Accession Number
AD0618981

Entities

People

  • G. S. Cole
  • W. C. Winegard

Organizations

  • University of Toronto

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Alloys
  • Antimony
  • Antimony Alloys
  • Binary Alloys
  • Metals
  • Temperature Gradients
  • Tin
  • Tin Alloys
  • Transition Temperature
  • Transitions

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.