THIN FILM ACCELERATED LIFE TESTS.

Abstract

The purpose of the program is to study, investigate, and develop test and measurement techniques for controllably accelerating the aging processes in tantalum thin film R-C networks, and to study and investigate the physics of failure associated with the R-C networks. The initial phase of the program included a review of related literature, the construction of individual tantalum thin film resistors and capacitors, accelerated testing of these structures, and failure mechanism determination. A number of failure modes were determined as a result of testing and analysis of the individual resistors and capacitors. There are indications that three basic failure mechanisms are related to all failures and are the failure rate controlling mechanisms; they are: (1) oxidation, (2) ion migration, and (3) crystallization (both fieldinduced and temperature induced). Some rate information was determined on the oxidation mechanism. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1965
Accession Number
AD0619689

Entities

People

  • M. J. Walker
  • M. Sharp

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accelerated Testing
  • Capacitors
  • Failure Mode And Effect Analysis
  • Film Resistors
  • Films
  • Life Tests
  • Oxidation
  • Resistors
  • Tantalum
  • Thin Film Resistors
  • Thin Films
  • Transition Temperature

Readers

  • Electrical Engineering
  • Materials Science (Mechanical Engineering).
  • Thin Film Deposition Science.