A POROUS SUBSTRATE RESISTOR AIMED AT MINIATURIZATION OF METAL-FILM RESISTORS.

Abstract

A correlation between structural characteristics of the substrate and reproducibility of resistance values is illustrated. It is advocated that the quality of the substrate can be typified by the standard deviation in weight-to-volume ratio and the standard deviation in flow. These two parameters have been combined to give a quantitative measure of substrate uniformity by defining a structure factor. In most cases, the average % standard deviation in resistance is linearly proportional to the structure factor. In obtaining this correlation, it is necessary to consider groups defined by substrate type and method of terminating. It is thus a statistical result which cannot be applied to individual units or metallizing lots. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1965
Accession Number
AD0619824

Entities

People

  • R. E. Busch
  • T. Matley

Tags

DTIC Thesaurus Topics

  • Electrical Impedance
  • Electrical Properties
  • Electrical Resistance
  • Electricity
  • Film Resistors
  • Films
  • Impedance
  • Metal Films
  • Metallizing
  • Miniaturization
  • Reproducibility
  • Resistance
  • Resistors
  • Standards
  • Substrates

Readers

  • Systems Analysis and Design
  • Thin Film Deposition Science.