A POROUS SUBSTRATE RESISTOR AIMED AT MINIATURIZATION OF METAL-FILM RESISTORS.
Abstract
A new method of soldering a terminal onto the porous substrate was attempted with encouraging results. This terminating method allows the metallizing to be performed prior to termination. The advantage is that better solution penetration during metallizing results if the surface of the substrate is not masked by terminals. A new cylindrical shaped substrate was successfully tried as a replacement for the old style. The new substrate measures 0.25' in diameter and 0.40' in length as compared to the old style that measures 0.30' X 0.30' X 0.40'. The new shape substrate is molded of the same material as the old style (Filtros Inc. Type K). (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- May 31, 1965
- Accession Number
- AD0621748
Entities
People
- P. M. Gross
- T. Matley