PRODUCTION ENGINEERING MEASURE (PEM) FOR TRANSISTOR, PNP, SILICON, SWITCHING TYPE EL-2N(X-12).

Abstract

The developmental geometry was modified from a stripe emitter to a circle emitter. Device geometry was made smaller and greater versatility was achieved. Initial material resistivity produced adequate breakdowns when epitaxial film thickness exceeded 0.20 mil. However, initial device runs were characterized by high V sub (CE(sat)') low h sub FE and absolute value (h sub fe). The fall off of h sub FE at low voltages and 10 milliamperes collector current was primarily due to the high V sub (CE(sat)). Plots of h sub FE and absolute value (h sub fe) vs. collector current indicated the peak point of operation was approximately one milliampere. Switching times reflected these problems in long rise and fall times. The parasitic capacitances of the device package and the switching jig prevented a delay time of three nanoseconds. Gold diffusion was successful in attaining storage times below nine nanoseconds. Leakage currents were not appreciably affected by gold diffusion. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 25, 1965
Accession Number
AD0621873

Entities

People

  • Larry Lands

Organizations

  • Texas Instruments

Tags

DTIC Thesaurus Topics

  • Accumulators
  • Capacitance
  • Diffusion
  • Engineering
  • Geometry
  • Low Voltage
  • Materials
  • Nanosecond Time
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Scheduling (Production)
  • Switching
  • Thickness
  • Transistors

Readers

  • Electronics Engineering
  • Materials Science and Engineering.
  • Radar Systems Engineering.