ENHANCED MICRO-MODULE INTERCONNECTIONS. AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS.

Abstract

A pilot production capability was established to assembly 100 Enhanced Micro Modules per eight hour shift. The Enhanced Micro Module is an all electron beam welded, hermetically sealed interconnection packaging system which is compatible with all approaches to microminiaturization. The production capability was demonstrated by the assembly of Engineering Model Design Enhanced Micro Modules which are nonfunctional units designed to check a significant number of welds as well as the integrity of the structure before and after environmental exposure. Ten Stage Binary Divider Enhanced Micro Modules were assembled to demonstrate compatibility with monolithic integrated circuits. All the tools, fixtures, machines and processes were developed and are operational. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 15, 1965
Accession Number
AD0622256

Entities

People

  • D. J. Garibotti

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Assembly
  • Circuits
  • Electrical Engineering
  • Electron Beams
  • Electrons
  • Engineering
  • Environmental Exposure
  • Integrated Circuits
  • Manufacturing
  • Mass Production
  • Microminiaturization
  • Packaging
  • Production
  • Production Engineering

Fields of Study

  • Engineering

Readers

  • Software Engineering

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems