MICROELECTRONIC SOLID-STATE DISPLAY ASSEMBLY.

Abstract

The work performed during this reporting period and described herein involved for the most part preparation for the configuration and fabrication studies that will be performed during the next two quarters. The essential features of the program plan, mask fabrication, CdSe preparation, and the testing circuitry are described. Tests made to determine the flatness of TIC etched glass and the variation of gap separation in the sandwich structure are also reported. The purpose of this program is to perform exploratory development of a Microelectronic Solid-State Display Assembly based on the molecular property of hysteresis in the electrical conductivity of cadmium selenide (CdSe). This hysteresis property can be used as a switch to control an electroluminescent (EL) element, and a major effort of the program is to demonstrate the feasibility of mass producing the CdSe-EL combination for use in low-cost displays. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1965
Accession Number
AD0623138

Tags

DTIC Thesaurus Topics

  • Assembly
  • Conductivity
  • Electrical Conductivity
  • Fabrication
  • Hysteresis

Readers

  • Human-Computer Interaction (HCI).
  • Materials Science and Engineering.
  • Software Engineering

Technology Areas

  • Microelectronics