THERMOELECTRIC JUNCTIONING PROJECT.
Abstract
Work on surface film analysis has progressed to the point where the cathodic etch process is controllable and films of 50 to 100 angstroms thickness can be deposited. A gold reference standard was developed, however, a superior platinum standard is now in process of evaluation. Partial identification of constituents of the sputtered films was accomplished. Melting point determination of solders was made and a near ternary eutectic solder of bismuth, antimony and tin was produced and evaluated. Examination of microstructures of solders and solder joints is in process. Studies of reaction rates between bismuth telluride, solder and copper were initiated. Diffusion layers produced in joining with the ternary eutectic solder were shown after long exposure at 450F. Ultrasonic tinning of bismuth telluride was not successful. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 31, 1963
- Accession Number
- AD0623730
Entities
People
- R. G. Sickert
Organizations
- Whirlpool Corporation