SPECIFIC FEATURES IN SOLDERING COPPER WITH GALLIUM-BASE SOLDERS,
Abstract
The use of pure gallium as a solder with subsequent heat treatment of the soldered joints at 50 to 605C (Oxidizing atmosphere, vacuum) does not assure a satisfactory strength of the soldered joints, either at room temperature or at high temperature. For obtaining soldered unions with satisfactory strength and high temperature of the unsoldering, a mixture of gallium with very fine powder of copper (30 percent of copper and 70 percent of gallium) is the best. The strength of the soldering and the temperature for the unsoldering are raised with the heating of the soldered joints in a vacuum. Similar heating in the air leads to a lowering of the strength from 6 to 0.5 kg/mm sq.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 17, 1965
- Accession Number
- AD0625145
Entities
People
- S. V. Lashko
- V. L. Grishin
Organizations
- National Air and Space Intelligence Center