MEANS OF LOWERING THE CURING TEMPERATURE OF HEATPROOF ORGANO-SILICON ADHESIVES,
Abstract
It was established that additions of pulverized glass to the VK-2 adhesives do not occasion any reduction in its curing temperature. The introduction of glass into the '588' composition in a quantity of 3% (dry weight) reduces the adhesives' curing temperature of 200C, providing the bonded joints a strength which is practically equal to their strength under optimum bonding conditions. A comparison of the results of the application of the above innumerated catalysts shows that the curing temperature can be reduced to 200-220C only with the introduction of Product 18 and potassium acetate into the VK-2 adhesive. A reduction of the curing temperature of the composition 588 down to 200-220C can be effected by all investigated additions. The data in Table 2 show that additions of the most active catalyzing components (Product 18, CH3 COOK, silica glass powder) to the VK-2 and 588 compositions do not occasion a negative effect on the thermal stability of the bonded joints. Observation of the changes in the properties of adhesive composition with additions of catalysts showed that TES and silica glass do not have any effect on the stability of the adhesive composition properties during their storage. Additions of Product 18 and potassium acetate have a catalyzing effect on the composition's 'aging' process; therefore they should be introduced directly before using the adhesive.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1965
- Accession Number
- AD0626049
Entities
People
- A. B. Davydov
- Z. G. Ivanova
Organizations
- United States Army Foreign Science and Technology Center