HIGH EFFICIENCY COOLING AND FACILITY MAINTENANCE

Abstract

An evaluation of pulsed peak power Amplitron vanes was carried out in the following four programs. The first program consisted of the design and evaluation of an inverted magnetron diode. During this program a test vehicle suitable for testing vanes at dissipation levels up to 400 kW/sq cm was designed and evaluated. The second program consisted of a study to determine the most suitable materials for pulse tube vanes, and the incorporation of these materials in test vanes. The six most suitable materials for pulse tube vanes were selected and the techniques for incorporating these materials in test vanes were worked out. The third program that was carried out consisted of designing and constructing a diode life test facility which allowed a number of diode tests to be conducted simultaneously. During the fourth program the effects of pulsed electron bombardment of platinum was studied. The effect was studied at five different dissipation density levels. This study confirms that surface stress cracking will occur at dissipation density levels over 100 kW/sq cm at a 10 microsec pulse width. It shows that while there is a large amount of surface roughening at dissipation density levels of 250 kW/sq cm, thousands of hours of operation are possible at dissipation density levels up to 250 kW/sq cm.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1965
Accession Number
AD0626477

Entities

People

  • L. J. Nichols

Organizations

  • RTX

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Life Tests
  • Magnetic Fields
  • Materials
  • Mechanical Working
  • Mechanics
  • Modulus Of Elasticity
  • Peak Power
  • Secondary Emission
  • Stress Cracking
  • Surface Temperature
  • Temperature Gradients
  • Tensile Strength
  • Test And Evaluation
  • Test Facilities
  • Test Vehicles
  • Thermal Conductivity

Fields of Study

  • Physics

Readers

  • Electronics Engineering
  • Pulsed Power and Plasma Physics.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics