A POROUS SUBSTRATE RESISTOR AIMED AT MINIAURIZATION OF METAL-FILM RESISTORS.
Abstract
The new cylindrical substrate was checked for uniformity of weight and weight-to-volume ratio. Reproducibility of metallizing was verified using the atmospheric technique. Fifteen lots of ten units per lot were metallized and variations within each lot and from lot-to-lot were noted. Some of these units were used later for load life and temperature coefficient of resistance testing. Development of the new solder terminal was completed and its quality was compared to the epoxy terminal using especially the 90 degree ratio test. A method of encapsulation was adopted utilizing a ceramic tube, end caps and an epoxy coating. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 30, 1965
- Accession Number
- AD0626482
Entities
People
- P. M. Gross
- R. E. Busch
- R. G. Drewes
- T. Matley