PRODUCTION ENGINEERING MEASURE FOR SILICON OVERLAY TRANSISTORS.
Abstract
Progress during the reporting period consisted of the following: (1)Diffusion systems. Work was completed on the BBr3 base diffusion system, and system feasibility was determined. The emitter-gold emitter diffusion system was also evaluated for feasibility. (2) Wafer processing. The feasibility of using 1 1/2 inch wafers with slurry polish and chemical etch was investigated. (3) Wafer storage. Devices which had been stored in N2 for 15 days at various steps were processed and evaluated. (4) Assembly processing. Units were constructed using ultrasonic wire bonding of aluminum wire to bare kovar posts and deionized water boiling prior to encapsulation. (5) Reliability. Completed units were evaluated. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 30, 1965
- Accession Number
- AD0628230
Entities
People
- Paul Greer
- Thomas Kearkuff
Organizations
- Motorola Mobility