THIN FILM MICROCIRCUIT INTERCONNECTIONS.
Abstract
Two patterns for interfacial interconnections and one pattern for the electrically insulating crossovers were designed. Masks were fabricated for these patterns which make possible, in a single deposition sequence, the fabrication of 440 interfacial interconnections or 1512 insulating crossovers. Processing specifications for the deposition of chromium-gold, chromium, and aluminum were established. A measurement technique and procedure were devised and proven for the accurate measurement of small D. C. voltages. Interfacial interconnections of the combinations chromium over chromium-gold, chromium-gold over chromium, chromium-gold over chromium-gold, aluminum over chromium-gold, and aluminum over chromium, were fabricated, tested, and evaluated. A qualitative estimate of the interfacial resistance corresponding to these conductor combinations was made. Preliminary adhesion tests were performed. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1966
- Accession Number
- AD0628577
Entities
People
- H. M. Greenhouse
- I. G. Goldsmith
- J. F. Bass
- T. H. Yaffe
- W. W. Richardson