RESEARCH AND DEVELOPMENT LOW COST INTEGRATED CIRCUIT TECHNIQUES.

Abstract

The use of an adherent impervious coating for encapsulating silicon integrated circuits, combined with a batch mounting and interconnection technique, will result in (1) decreased cost as a result of package elimination; (2) increased packing density; (3) improved reliability due to reduction in the number of contacts and elimination of Au-Al thermocompression bonds. This report describes a technique for selective deposition of 1 to 2 micron thick glass on silicon integrated circuits and attaching these circuits to a printed circuit board by means of 'flip chip' mounting. Glass has been deposited by means of evaporation and pyrolytic vapor plating. Evaporation appears to have some advantages. Evaluation of two high temperature metalization systems (Ti-Ag-Ti and Cr-Ag-Cr) has indicated satisfactory properties. A test model employing these techniques has been designed for environmental testing and technique evaluation. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 14, 1965
Accession Number
AD0628618

Entities

People

  • Michael Walker
  • Samuel G. Wagner

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Boards
  • Circuits
  • Elimination
  • Evaporation
  • Flip Chips
  • High Temperature
  • Integrated Circuits
  • Packing Density
  • Printed Circuit Boards
  • Printed Circuits
  • Test And Evaluation
  • Transition Temperature
  • Vapor Plating

Readers

  • Integrated Circuit Design and Technology.
  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.