THERMAL CRACKING OF WAVEGUIDE WINDOWS

Abstract

A theory is derived to explain the cracking of waveguide windows due to stresses generated by heat dissipated in the window when subject to the RF fields in a waveguide. Calculations of the temperature rise and power-handling ability of half-wavelength block windows at X-band are presented.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Feb 09, 1966
Accession Number
AD0628907

Entities

People

  • C. E. Muehe

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Air Force
  • Buildings And Structures
  • Coefficients
  • Electric Fields
  • Losses
  • Materials
  • Modulus Of Elasticity
  • Power
  • Power Levels
  • Silica Glass
  • Standing Waves
  • Stresses
  • Temperature Coefficients
  • Waveguide Windows
  • Waveguides
  • X Band

Fields of Study

  • Physics

Readers

  • Electronics Engineering
  • Mechanical Engineering/Mechanics of Materials.