MULTILAYER BOARD APPLICATION TO RF CIRCUITRY.
Abstract
Investigation of miniaturization techniques suitable for a quick reaction facility was continued, and techniques developed during previous R and D programs were improved. Applications of miniaturization techniques to linear circuits in the very high and ultra high frequency ranges were made successfully. Extensive use of multiple-layer, printed wiring boards was made to maintain and update the state of the art in the laboratory. These boards were designed to fit into extrusions to give support and isolation to the circuit. Performance data are included in the report, with an analysis of the major components of the designs. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 24, 1965
- Accession Number
- AD0629890
Entities
People
- Mark Hurowitz
- William E. Berg
Organizations
- Sylvania Electric Products