RELATIONSHIP BETWEEN EMBRITTLEMENT BEHAVIOR AND INTERFACIAL ENERGIES FOR COPPER WETTED WITH BINARY BISMUTH-THALLIUM LIQUID METAL ALLOYS AT 650 F,
Abstract
Embrittlement behavior of copper was studied in terms of interfacial energies between the solid copper and binary bismuth-thallium liquid metal compositions. Wetted fracture strength determinations were made on copper tensile specimens which were in contact with the liquid metal alloys at 650 F. Tests were made as the relative proportions of bismuth and thallium in the liquid wetting metal were varied. It was found that the embrittling effect of bismuth on copper decreases as the thallium content of the wetting bismuth-thallium alloy is increased. This trend to higher strength values was correlated with the corresponding increase in interfacial energies for the copper-bismuth-thallium system. The embrittlement of solid copper may be related to reductions in surface energy requirements needed for crack propagation as a result of the presence of the liquid metal. However, deviations noted in the relationship between wetted fracture strength values and interfacial energies suggest that embrittlement behavior cannot be explained fully on the basis of interfacial energies alone. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1966
- Accession Number
- AD0630420
Entities
People
- Bernard J. Rogus