MICROBONDS FOR HYBRID MICROCIRCUITS.
Abstract
Test results, statistical analysis, and failure modes of over ten types of split-tip welded microbonds between fine gold and aluminum wires (.0007, .002 and .005-in. dia.) to gold and aluminum films are discussed as well as bonding techniques for the newly emerging flip-chip devices. Reliable split-tip welded microbonds can be made between gold wires and films of gold/chromium or gold/nickel/ molybdenum manganese on 'as-fired' alumina. The quantity of gold system microbonds on glass, glazed alumina, and oxidized silicon were statistically analyzed. A minimum of 15,000 A of gold are required to obtain optimum microbonds. The optimum thickness of the fired -on Au-Ni-MoMn system was 0.001 inch. The sensitivity of glass and glazed alumina substrates to thermal shock adversely affected bond strength reliability. Gold system microbonds on oxidized silicon substrates could not be made meeting the full reliability requirements of the contract although a fair degree of reproducibility was demonstrated. Marginal or unsatisfactory microbonds were found between aluminum wire and Au/Cr or aluminum films regardless of substrate material. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1966
- Accession Number
- AD0630948
Entities
People
- P. R. Amlinger
- S. Rogers