INTEGRATED CIRCUITS FOR FIELDATA COMPUTERS.

Abstract

MATERIALS AND PROCESSES: Two dielectric isolation methods were explored for implementation of circuits. These are: (1) thermally grown silicon dioxide with a polycrystalline silicon matrix, and (2) glass isolation with a dummy silicon support slice. The latter technique appears most applicable because of still lower capacitances to the substrate. The glass isolation lends itself to the simpler implementation of beam-lead technology if desired. CIRCUITS: Emitter current-steered (ECL) and saturating high speed (TTL) circuit configurations were explored, both with the view toward obtaining the required speed/power product. The circuits were also considered from the point of view of radiation hardening possibilities. The present activities are directed toward the use of the TTL logic function. Linear high frequency amplifier studies were performed and evaluations made as to implementation utilizing dielectric isolation techniques. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1966
Accession Number
AD0631027

Entities

People

  • James Solomon
  • Ury Davidsohn

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Beam Lead Technology
  • Beam Leads
  • Circuits
  • Frequency
  • Hardening
  • Integrated Circuits
  • Materials
  • Radiation
  • Radiation Hardening
  • Silicon
  • Silicon Dioxide

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Systems Analysis and Design