MICROBONDS FOR HYBRID MICROCIRCUITS.
Abstract
The overall objective of the program is development of reliable high yield processes for bonding fine wires of gold and aluminum to gold-chromium and aluminum films on various substrates such as alumina, sapphire, and oxidized silicon. The reliability goal of a maximum expected failure rate of 3 bonds per 1000 at a 90% confidence level was demonstrated for type H microbonds (0.001 inch gold wire resistance welded to gold-chromium film on oxidized silicon). Preliminary bonding of riser wires to edge terminations of Ni/Au/Cr films on (as-fired) alumina (Type V microbonds) was initiated. It was found that use of gold-plated copper matrices resulted in low mean pull strength. A survey of available flap-pack lead material and multilayer circuit boards was started. Sample welds made with a parallel-gap resistance welder were investigated but no conclusions could be drawn. The investigation of flip-chip bonding, was continued on a limited basis. However, the preliminary results using a soldering technique indicated the bonds were not as reliable as desired and that other bonding techniques such as ultrasonic bonding should be investigated.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 06, 1966
- Accession Number
- AD0631288
Entities
People
- P. R. Amlinger
- S. L. Sherman