RESEARCH ON HOT WORKING OF METALS, WITH PARTICULAR REFERENCE TO MICROSTRUCTURE, MECHANICAL PROPERTIES AND TEXTURE

Abstract

The structure and stress-strain behaviour of O.F.H.C. copper deformed at temperatures in the range -196C to 600C, and at two strain rates, 0.005 and 500/sec, were studied. A correlation was made between the structures observed optically and by transmission electron microscopy. At the low strain-rate the deformation processes varied considerably over the temperature range, but at the high strain rate the variation was small. Indications of deformation twinning were found at the high strain rate at temperatures up to 450C. Cross-slip was favored by the high strain-rate. The effect of deformation temperature on the preferred orientation produced by rolling a number of pure f.c.c. metals was studied. Variations in the rolling texture could be related to the ease of cross slip in the metal, and this concept was used to estimate the stacking fault energy of some f.c.c. metals. The rolling textures developed in f.c.c. and b.c.c. metals are explained in terms of realistic stress systems, and the variation in texture through the thickness of rolled sheet is related to rotations of the effective stress system which are governed by friction between the sheet and rolls.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1964
Accession Number
AD0631407

Entities

People

  • I. L. Dillamore
  • W. T. Roberts

Organizations

  • University of Birmingham

Tags

Communities of Interest

  • Air Platforms
  • C4I
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Construction
  • Crystals
  • Deformation (Mechanics)
  • Electron Microscopes
  • Electron Microscopy
  • High Temperature
  • Low Temperature
  • Materials
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Microscopes
  • Microscopy
  • Shear Stresses
  • Stress Strain Relations
  • Stresses

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.

Technology Areas

  • Microelectronics