LOW COST INTEGRATED CIRCUIT TECHNIQUES.

Abstract

Both the evaporated and pyrolytic glass deposition techniques have been improved, resulting in encapsulating deposits of higher quality. The pinhole problem associated with the evaporated glass has been nearly eliminated. Also, improved adherence has been obtained with the pyrolytically deposited glass. Glass delineation was improved by using an improved fixture for evaporation through a metal mask. Some improvement was also made in the delineation of pyrolytically deposited glass. In the work on glass evaluation techniques, a method involving pressurized steam has proven to be effective in the relative evaluation of the passivating properties of glass. Also, mobile charge concentration studies were performed on both evaporated and pyrolytically deposited glass. Problems encountered in metalization include increased ohmic contact resistance and poor delineation. Some test models have been produced, although device and metal delineation problems have delayed the completion of the vehicles. The vehicles have been subjected to preliminary electrical and environmental evaluation. A plan for the testing and specification of the preliminary exploratory development models was prepared. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1966
Accession Number
AD0631491

Entities

People

  • Mauro Walker
  • Sturger Wagner

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Circuits
  • Electronic Equipment
  • Electronics
  • Evaporation
  • Integrated Circuits
  • Metal-Semiconductor Junctions
  • Resistance
  • Semiconductor Devices
  • Solid State Electronics
  • Specifications
  • Test And Evaluation

Readers

  • Nanofabrication and Microfabrication.
  • Polymer Science and Engineering.
  • Semiconductor Device Technology