MICROMINIATURIZATION MULTIPLANE INTERCONNECTIONS.
Abstract
The purpose of this work is the development of interconnections for ultra-high-speed MICRO-CIRCUIT MODULE ARRAYS. The MCM passive crosstalk analysis and measurements are presented. From these results, the MCM must use matched lines with characteristic impedances below 400 ohms if crosstalk is to be below 10% over the frequencies of interest. Progress on the subassembly and assembly designs is described. Various delay measurements on the ultra-high-speed gate, show that the system delay will be below 5 nanoseconds, if less than plus or minus 15% change in line impedance is maintained. Thermal resistance from circuit to case has been analyzed, and with the present chip size (40 x 40 mils) it will be below 13 C/W. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1966
- Accession Number
- AD0632335
Entities
People
- William T. Rhoades
Organizations
- Hughes Aircraft Company