MICROMINIATURIZATION MULTIPLANE INTERCONNECTIONS.
Abstract
The purpose of this work is the development of interconnections for ultrahigh-speed-Micro-Circuit Module arrays. Four module packaging approaches for ultra high speed circuits, along with a new packaging technique, are presented and compared. High complexity arrays are discussed and analyzed from the viewpoint of cost and performance. Progress on the subassembly and assembly and assembly designs is described. Various power requirements and delay measurements on the ultra-high-speed gate are given. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1966
- Accession Number
- AD0632390
Entities
People
- William T. Rhoades
Organizations
- Hughes Aircraft Company