THIN FILM TECHNIQUES FOR SILICON INTEGRATED CIRCUITS.

Abstract

This program is a continuation of the program initiated in 1963. Under the initial program the contractor studied the effects of thin film materials and processes used in the film technologies existing at that time. The compatibility of materials and processes with silicon integrated circuits was verified. Thin film resistive and capacitive elements were fabricated on silicon chips containing a 2N708-class silicon transistor; a detailed characterization of these samples was made. The required circuits were fabricated, characterized, and delivered to the USAEL. The performance objectives of the present program was to obtain compatible thin film capacitors and resistors.

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1966
Accession Number
AD0632931

Entities

People

  • C. D. Phillips
  • R. W. Wilson

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Capacitors
  • Circuits
  • Films
  • Integrated Circuits
  • Materials
  • Thin Film Capacitors
  • Thin Films
  • Transistors

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Software Engineering