MICROBONDS FOR HYBRID MICROCIRCUITS
Abstract
The mechanical strengths (1) 0.001 inch A1 wire ultrasonically bonded to Au/Cr films on as-fired alumina, (2) 0.005 inch Au wire resistance welded to Au/Cr films on sapphire, (3) 0.002 inch Au wire resistance welded to Au/Cr films on beryllia, (4) 0.005 inch inch wire resistance welded to Au/Cr films on beryllia, (5) 0.001 inch A1 wire ultrasonically bonded to Au/Cr films on sapphire, (6) 0.002 inch A1 wire ultrasonically bonded to Au/Cr films on sapphire and (7) 0.002 inch A1 wire ultrasonically bonded to Au/Cr films on beryllia were evaluated. The reliability goal of an expected failure of no more than 3 bonds per thousand at the 90% confidence level was met for the no. 3 and 4 microbonds. Electrical resistance measurements demonstrated that all bonds completed to date met the contractual goal. Thermal aging tests indicated that a number of bond types met the contractual goal for a temperature of 125C, and of these all but one met the goal at 200C. Stack welded microbonds consisting of 0.002 in. Au-plated-Ni wire welded to Ni/Au/Cr films on alumina were completed and the maximum number of expected bond failures was 5 per thousand.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1966
- Accession Number
- AD0633723
Entities
People
- A. R. Riben
- S. L. Sherman